Teledyne FLIR, a part of Teledyne Technologies Incorporated, has announced the next-generation embedded software for its Boson+ thermal camera module.
This ITAR-free product provides high-performing uncooled thermal imaging technology for various applications, including defense, firefighting, automotive, security, and surveillance.
As reported by Teledyne FLIR, the Boson+ features industry-leading thermal sensitivity of ≤20 mK.
It offers sharper thermal imagery and improved spatial filtering.
This continuous improvement in thermal performance, coupled with proven reliability, makes Boson+ an ideal choice for integration into unmanned platforms, security applications, handhelds, wearables, and thermal sights.
Dan Walker, vice president of product management, OEM cores at Teledyne FLIR, stated: “Boson+ shares the industry-leading size, weight, and power (SWaP) of the widely deployed Boson thermal camera module, simplifying integration and shortening time to market for our customers.”
He also highlighted the new software updates, which include new color palettes, low gain mode, and an updated GUI.
The Boson+ seamlessly interfaces with the new Teledyne FLIR AVP, an advanced video processor that supports Prism™ AI and computational imaging at the edge.
Built on the latest Qualcomm QCS8550, the AVP efficiently runs Prism AI software for detection, classification, and target tracking.
Additionally, it operates Prism ISP algorithms, enhancing data fidelity and decision support through features like super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction.
Made in the USA, the Boson+ features a 12-micron pixel pitch and is available in both 320 x 256 and 640 x 512 resolutions.
It has a noise equivalent differential temperature (NEDT) of 20 mK or less, which enhances detection, recognition, and identification (DRI) performance.
The improved video latency supports better tracking, seeker performance, and decision-making processes.
Designed with integrators in mind, the Boson+ comes with a variety of lens options, comprehensive product documentation, an easy-to-use SDK, and a user-friendly GUI.
Customers also benefit from access to the US-based Teledyne FLIR Technical Services team, which helps reduce development risk and costs.
The Boson+ is classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a and is available globally from Teledyne FLIR and its authorized dealers.
The Boson+ is AI-ready and continues to be favored by defense, industrial, and commercial integrators.
Its integration with the Teledyne FLIR AVP allows for advanced processing capabilities, making it a versatile choice for various demanding applications.
The enhanced features and reliable performance of the Boson+ thermal camera module reaffirm its position as a leading product in the thermal imaging market.
